Medium Temperature SMT Soldering Paste Sn63/Pb37, 22–40μm Alloy Powder, BGA Reballing & PCB Repair Solder Flux, 35g
The Jaston JSD-750A Leaded Solder Paste is a high-quality medium temperature SMT solder paste specially formulated for BGA reballing, chip soldering, PCB repair, and electronics assembly. With a Sn63/Pb37 alloy composition and fine 22–40μm solder particles, it delivers excellent adhesion, smooth printing, and bright, reliable solder joints.
This solder paste ensures stable viscosity, minimal residue, strong wetting ability, and full bright solder points for professional results. It is easy to apply, resists oxidation, and provides excellent electrical conductivity without corroding PCB boards. Suitable for computer motherboards, LED modules, chip rework, and precision electronics, this paste is trusted by technicians and hobbyists alike.
Each jar contains 35g, stored at 5–10°C for optimal performance.
Alloy Composition: Sn63/Pb37 (Leaded, 63% Tin, 37% Lead)
Particle Size: 22–40μm fine solder powder
Melting Point: 183°C (Medium Temperature)
Net Weight: 35g per jar
Applications: SMT, BGA reballing, LED soldering, motherboard repair, precision PCB work
The extra large Soldering Repair Mat is an essential tool for any professional or DIY enthusiast. Measuring 70x40cm, heat resistant silicone pad provides a stable and safe surface for soldering and repairs. Protect your work area from heat damage and easily clean up any soldering residue.
Heat Resistant: Withstands high temperatures up to 500°C, perfect for soldering and electronics work.
Extra Large Size: Spacious 70x40cm surface offers plenty of room for all repair tasks.
Easy to Clean: Made from flexible, non-toxic silicone that wipes clean effortlessly.
Durable & Non-Slip: Anti-slip design stays firmly in place on your workbench.
The JASTON JSD-1043K is a high-performance golden thermal grease that is designed to transfer heat away from CPU, GPU, chipset, and LED components.
It has a thermal conductivity of >3.6 W/m·K, which is higher than most other thermal greases on the market.
It also has a low viscosity, making it easy to apply and spread.
The JSD-1043K is compatible with a wide range of applications and has a working temperature range of -30 to 300°C.
This makes it a great choice for a variety of electronic devices, including computers, laptops, smartphones, and tablets.
Jaston JSD-203A Rosin Flux Paste is a high-quality, rosin flux paste that is ideal for soldering, PCB repair, and BGA welding applications. It is made with a rosin flux, which makes it easy to use and produces high-quality solder joints. The flux paste is also viscosity and graininess controlled, ensuring a consistent and reliable performance.
Features:
Rosin flux
Easy to use
Produces high-quality solder joints
Viscosity and graininess controlled
Ideal for soldering, PCB repair, and BGA welding applications
Benefits:
Repairs PCB circuit boards
Solders electronic components
Performs BGA welding
Easy to use
Produces high-quality solder joints
Consistent and reliable performance
Applications:
Soldering
PCB repair
BGA welding
Mechanic XGSP80 Lead-Free Soldering Paste is a high-quality, lead-free soldering paste that is ideal for PCB, mobile phone repair, and BGA welding applications. It is made with a tin-lead alloy and a rosin flux, which makes it easy to use and produces high-quality solder joints. The solder paste is also viscosity and graininess controlled, ensuring a consistent and reliable performance.
Alloy Sn63 Pb37
Rosin flux IPX3
Microns 3#
Easy to use
Produces high-quality solder joints
Benefits:
Repairs PCB circuit boards
Solders electronic components
Performs BGA welding
Repairs mobile phones
Easy to use
Produces high-quality solder joints
Consistent and reliable performance
Applications:
PCB repair
Electronic component soldering
BGA welding
Mobile phone repair
JASTON JSD-16S is a lead-based BGA rework solder paste with a tin-lead alloy. It is ideal for mobile phone repair, chip planting, and electronic component soldering applications. The solder paste is easy to use and produces high-quality solder joints. It is also viscosity and graininess controlled, ensuring a consistent and reliable performance.
Features:
Lead-based
Tin-lead alloy
Rosin flux
Easy to use
Produces high-quality solder joints
Viscosity and graininess controlled
Ideal for BGA rework, mobile phone repair, chip planting, and electronic component soldering applications
Small size, easy to carry
Benefits:
Repairs PCB circuit boards
Solders electronic components
Performs BGA welding
Repairs mobile phones
Easy to use
Produces high-quality solder joints
Consistent and reliable performance
Portable and easy to carry
Applications:
BGA rework
Mobile phone repair
Chip planting
Electronic component soldering
