Description
Mechanic XG-50 Solder Paste Flux - Professional Grade for Electronics Repair
Achieve clean, reliable solder joints every time with the Mechanic XG-50 Solder Paste Flux. Trusted by electronics technicians, mobile phone repair professionals, and PCB assembly specialists across the UAE and beyond, this medium-temperature solder paste delivers consistent performance for SMT, BGA, and through-hole soldering applications.
Whether you're repairing a smartphone motherboard, assembling an LED PCB, or reworking BGA chips, the XG-50 flows smoothly, minimizes bridging, and leaves a clean finish - saving you time and reducing rework.
Key Specifications
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Brand: Mechanic (Hong Kong Welsolo Metal Technology)
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Model: XG-50
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Weight: 35g
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Alloy Composition: Sn63/Pb37 (Tin 63% / Lead 37%)
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Melting Point: 183°C
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Particle Size: 25-45 microns
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Mesh: -325+500
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Type: Medium-Temperature Solder Paste Flux
Applications
- SMT (Surface Mount Technology) soldering
- BGA (Ball Grid Array) chip rework and welding
- LED PCB board assembly
- Circuit board repair and component replacement
- Mobile phone and tablet motherboard repair
- Computer and appliance electronics repair
Why Choose Mechanic XG-50?
- Fine particle size (25-45um) ensures excellent printability and paste release
- Sn63/Pb37 eutectic alloy provides a sharp melting point at 183°C for predictable reflow
- Minimal flux residue - easy to clean after soldering
- Consistent viscosity for stencil printing and manual application
- Trusted brand used by professional repair technicians worldwide
Ideal for hobbyists, electronics repair shops, and professional PCB assembly technicians looking for a reliable, affordable solder paste solution.
