Description
Jaston JSD-750A Medium-Temperature Leaded Solder Paste - Professional SMT & BGA Repair
The Jaston JSD-750A Solder Paste is a premium medium-temperature, leaded solder paste engineered for professional SMT assembly, BGA chip reballing, and PCB motherboard repair. With a fine, smooth paste consistency and Sn63/Pb37 eutectic alloy composition, it delivers full, bright, reliable solder joints with minimal bridging and virtually no residue.
Whether you're reballing BGA chips on a smartphone motherboard, printing solder paste for SMT assembly, or reworking computer board components, the JSD-750A provides the consistent viscosity and excellent wettability that repair professionals demand.
Key Specifications
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Brand: Jaston (佳士顿)
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Model: JSD-750A
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Type: Medium-Temperature Leaded Solder Paste
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Alloy Composition: Sn63/Pb37 (Tin 63% / Lead 37%)
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Particle Size: 22-40 microns
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Weight: 35g
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Storage Temperature: 5-10°C
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Origin: Made in China
Applications
- SMT (Surface Mount Technology) stencil printing and assembly
- BGA (Ball Grid Array) chip reballing and rework
- Mobile phone and tablet motherboard chip repair
- Computer mainboard component soldering
- PCB (Printed Circuit Board) precision soldering
- LED board and electronic component assembly
Why Choose Jaston JSD-750A?
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Fine Paste Texture - smooth, uniform consistency for precise stencil printing and manual application
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Optimal Viscosity - paste stays moist and workable, does not dry out or clump during extended printing sessions
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Full, Bright Solder Joints - produces shiny, void-free joints with no cold solder or false joints
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Strong Adhesion - excellent tack strength keeps SMD components in place before reflow, minimal component shift
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No-Clean Formula - minimal flux residue after soldering, no mandatory cleaning required
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Anti-Oxidation - resists oxidation for consistent performance and longer shelf life
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Good Electrical Conductivity - reliable electrical connections for precision electronics
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Non-Corrosive to PCB - safe for use directly on circuit boards without damaging substrate or traces
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Low Bridging - fine particle size (22-40um) minimizes solder bridging between pads
How to Use
- Store at 5-10°C and allow paste to reach room temperature before use (approx. 1-2 hours).
- Stir gently before application to ensure uniform consistency.
- Apply via stencil printing or manually to solder pads or BGA balls.
- Place components and reflow using a hot air station or reflow oven.
- Inspect joints - no cleaning required with the no-clean formula.
Trusted by mobile phone repair technicians, PCB assembly professionals, and electronics engineers for consistent, high-quality soldering results.
