Description
Medium Temperature SMT Soldering Paste Sn63/Pb37, 22–40μm Alloy Powder, BGA Reballing & PCB Repair Solder Flux, 35g
The Jaston JSD-750A Leaded Solder Paste is a high-quality medium temperature SMT solder paste specially formulated for BGA reballing, chip soldering, PCB repair, and electronics assembly. With a Sn63/Pb37 alloy composition and fine 22–40μm solder particles, it delivers excellent adhesion, smooth printing, and bright, reliable solder joints.
This solder paste ensures stable viscosity, minimal residue, strong wetting ability, and full bright solder points for professional results. It is easy to apply, resists oxidation, and provides excellent electrical conductivity without corroding PCB boards. Suitable for computer motherboards, LED modules, chip rework, and precision electronics, this paste is trusted by technicians and hobbyists alike.
Each jar contains 35g, stored at 5–10°C for optimal performance.
- Alloy Composition: Sn63/Pb37 (Leaded, 63% Tin, 37% Lead)
- Particle Size: 22–40μm fine solder powder
- Melting Point: 183°C (Medium Temperature)
- Net Weight: 35g per jar
- Applications: SMT, BGA reballing, LED soldering, motherboard repair, precision PCB work
