Description
TE-707 High-Temperature Silicone Soldering Pad - iPhone CPU and IC Repair
A circular silicone heat-insulation and positioning pad designed for iPhone CPU reballing, BGA soldering, and IC component repair. Provides a stable, heat-resistant work surface with pre-formed slots for positioning iPhone components during hot air rework.
Product Specifications
- Model: TE-707
- Material: High-temperature silicone
- Diameter: 125mm
- Thickness: approx. 4.8mm
- Max Temperature Resistance: 500°C
- Color: Blue
Component Slots Included
The pad features precision-cut positioning slots for the following iPhone components:
- CPU placement recess (central slot)
- iPhone X Face ID component slot
- iPhone XS Face ID component slot
- iPhone 11 Face ID component slot
- iPhone 12 Face ID component slot
- iPhone 13 Face ID component slot
- iPhone 14 Plus Face ID component slot
- iPhone 14 Pro / 14 Pro Max Face ID component slot
- IR front camera positioning slot
- Dot projector (point matrix) component slot
- Fingerprint sensor slot
Material Properties
- Heat resistant up to 500°C - suitable for hot air rework stations
- Corrosion resistant - withstands flux, solvents, and cleaning agents
- High flexibility - returns to shape after bending, does not deform permanently
- Non-swelling surface - maintains flat work surface under heat
- Thickness approx. 4.8mm for stable component support
Suitable For
- iPhone CPU reballing and BGA soldering
- iPhone Face ID module positioning during rework
- Hot air rework station use
- Board-level iPhone repair and soldering
Note: Designed for use with hot air rework stations. Verify component slot compatibility with your specific iPhone model before use. Not intended for non-Apple devices unless slot dimensions are confirmed to match.
